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arxiv: 2607.01514 · v1 · pith:VDZTFYFTnew · submitted 2026-07-01 · ⚛️ physics.optics

Monolithic Integration of Piezo-Optomechanical Photonics and CMOS Electronics

Matthew Zimmermann , Aileen Zhai , Andrew J. Leenheer , Julia Boyle , Mayank Mishra , Daniel Dominguez , Matthew Koppa , Wolf Jehle
show 5 more authors
Christopher Panuski Mark Dong Gerald Gilbert Dirk Englund Matt Eichenfield
This is my paper

Pith reviewed 2026-07-03 18:17 UTC · model grok-4.3

classification ⚛️ physics.optics
keywords monolithic integrationpiezo-optomechanical photonicsCMOS electronicsphotonic integrated circuitsback-end-of-line processingphotonic digital-to-analog converterssilicon nitride waveguides
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The pith

Piezo-optomechanical photonic devices can be monolithically fabricated on finished CMOS wafers using back-end processing.

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The paper establishes that photonic integrated circuits using piezoelectric actuators can be added directly onto completed commercial CMOS chips. This integration links over two million electrical connections per die to control optical components like phase shifters and ring resonators. A sympathetic reader would care because it removes the need for separate electronic and photonic chips, potentially allowing much larger and more complex photonic systems for applications in computing and sensing. The approach uses standard wafer-scale manufacturing steps to achieve this co-fabrication across 200 millimeter wafers.

Core claim

A fully monolithic platform for piezo-optomechanical photonic integrated circuits is co-fabricated with commercial control electronics on 200 millimeter wafers. Photonic layers are constructed on completed CMOS driver wafers by back-end-of-line processing. This connects integrated piezoelectric actuators under broadband silicon nitride waveguides to a high-density digital backplane with more than two million electrical connections per die at a 6.4 by 6.4 micron electrode pitch. Segmented components function as photonic digital-to-analog converters that turn low-voltage digital signals into multi-bit analog optical phase and amplitude modulation, with parallel control demonstrated via a stand

What carries the argument

Back-end-of-line processing that builds the photonic layer on completed CMOS wafers, linking piezoelectric actuators under silicon nitride waveguides to a high-density digital backplane with over two million connections per die.

If this is right

  • Segmented POMPIC components convert digital electronic signals to analog optical modulation as photonic digital-to-analog converters.
  • Parallel control of optical phase shifters, Mach-Zehnder interferometers, optical routing trees, and tunable ring resonators is achieved using a standard HDMI interface to program the CMOS electronics.
  • Wafer-scale integration is demonstrated through electronic and photonic characterization across multiple reticles and the entire wafer to establish uniformity and yield.
  • Dense scalable electronic control of piezo-optomechanical circuits becomes possible through the high-density backplane.

Where Pith is reading between the lines

These are editorial extensions of the paper, not claims the author makes directly.

  • The platform could support control of thousands to millions of reprogrammable photonic devices on a single chip without separate packaging.
  • The same integration approach might be tested on other photonic material stacks or different CMOS process nodes.
  • Cryogenic compatibility of the combined system could be checked to assess suitability for quantum computing applications.

Load-bearing premise

Back-end-of-line processing to build the photonic layer on completed CMOS wafers does not degrade the performance or yield of either the electronic drivers or the piezo-optomechanical components.

What would settle it

A direct comparison of CMOS driver functionality and photonic modulation efficiency before and after the back-end-of-line photonic layer deposition that shows significant degradation.

read the original abstract

Next-generation photonic architectures for AI, sensing, and quantum computing require thousands to millions of reprogrammable photonic devices on a chip[1]. The monolithic integration of Electronically-backed Photonic Integrated Circuits (EPICs) allows for very high density electrical interconnection and electronic drivers that can scale with photonics. Piezo-optomechanical photonic integrated circuits (POMPICs) offer low power consumption, high speed modulation, cryogenic compatibility and broadband optical transparency from ultraviolet to infrared wavelengths[2,3], but have not been demonstrated with monolithically integrated CMOS electronics. Here, we show a fully monolithic, all-CMOS fabricated platform for POMPICs co-fabricated with commercial control electronics. 200 millimeter photonic wafers are constructed directly on completed CMOS driver wafers by back-end-of-line processing, connecting integrated piezoelectric actuators under broadband silicon nitride waveguides to a high-density digital backplane comprising >2 million electrical connections per die with 6.4x6.4 micron electrode pitch. We introduce segmented POMPIC components as Photonic Digital-to-Analog converters (PDACs) that convert low-voltage digital electronic signals to multi-bit analog optical phase and amplitude modulation, and we demonstrate parallel control of optical phase shifters, Mach-Zehnder interferometers, optical routing trees, and tunable ring resonators using a standard HDMI interface to program CMOS electronics. We test multiple reticles and perform electronic and photonic characterization across the entire wafer to establish uniformity and yield, demonstrating wafer-scale integration of POMPICs on an electronic backplane and enabling dense, scalable electronic control of piezo-optomechanical circuits.

Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, simulated authors' rebuttal, and a circularity audit. Tearing a paper down is the easy half of reading it; the pith above is the substance, this is the friction.

Referee Report

2 major / 0 minor

Summary. The manuscript claims a fully monolithic all-CMOS platform for piezo-optomechanical photonic integrated circuits (POMPICs) fabricated directly on completed 200 mm CMOS driver wafers via back-end-of-line processing. It reports integration of piezoelectric actuators under broadband SiN waveguides with a high-density digital backplane (>2 million electrical connections per die at 6.4×6.4 μm pitch), introduces segmented Photonic Digital-to-Analog Converters (PDACs) for multi-bit analog optical modulation from low-voltage digital signals, demonstrates parallel HDMI-programmed control of phase shifters, Mach-Zehnder interferometers, routing trees, and tunable rings, and states that wafer-scale electronic/photonic characterization across multiple reticles establishes uniformity and yield.

Significance. If the central claims are substantiated, the work would provide a concrete route to dense, scalable electronic control of low-power, broadband, cryogenic-compatible POMPICs, addressing a key barrier in EPIC architectures for AI, sensing, and quantum applications by eliminating hybrid bonding and enabling >2 M connections per die.

major comments (2)
  1. [Abstract] Abstract: the claim that 'wafer-scale electronic and photonic characterization was performed to establish uniformity and yield' is presented without any quantitative metrics, error bars, yield percentages, uniformity statistics (e.g., standard deviation of actuator response or driver swing), or pre-/post-BEOL comparisons of CMOS parameters (threshold voltage, leakage, output swing) or piezo actuator yield. This data is load-bearing for the assertion that BEOL processing leaves both electronics and optomechanical performance intact.
  2. [Main text (fabrication and characterization sections)] Main text (fabrication and characterization sections): no explicit pre-/post-BEOL device metrics or failure-mode analysis are supplied to substantiate that the high-density electrode pitch and >2 M connections per die remain functional after photonic/piezo layer deposition, which is the least secure precondition for the monolithic scalability claim.

Simulated Author's Rebuttal

2 responses · 0 unresolved

We thank the referee for their careful reading and for highlighting the need for quantitative substantiation of our wafer-scale uniformity and yield claims. We address each major comment below.

read point-by-point responses

  1. Referee: [Abstract] Abstract: the claim that 'wafer-scale electronic and photonic characterization was performed to establish uniformity and yield' is presented without any quantitative metrics, error bars, yield percentages, uniformity statistics (e.g., standard deviation of actuator response or driver swing), or pre-/post-BEOL comparisons of CMOS parameters (threshold voltage, leakage, output swing) or piezo actuator yield. This data is load-bearing for the assertion that BEOL processing leaves both electronics and optomechanical performance intact.

    Authors: We agree that the abstract would be strengthened by explicit quantitative metrics. In the revised manuscript we will expand the abstract to report key statistics from our wafer-scale data, including yield percentages, uniformity (standard deviations of actuator response and driver swing), and available pre-/post-BEOL CMOS parameter comparisons. revision: yes

  2. Referee: [Main text (fabrication and characterization sections)] Main text (fabrication and characterization sections): no explicit pre-/post-BEOL device metrics or failure-mode analysis are supplied to substantiate that the high-density electrode pitch and >2 M connections per die remain functional after photonic/piezo layer deposition, which is the least secure precondition for the monolithic scalability claim.

    Authors: We acknowledge that explicit pre-/post-BEOL metrics and failure-mode discussion are needed to fully substantiate functionality of the high-density interconnects. The revised manuscript will add dedicated subsections in the fabrication and characterization sections that present pre- and post-BEOL CMOS and piezo device metrics together with any observed failure modes. revision: yes

Circularity Check

0 steps flagged

No circularity: experimental fabrication report with no derivations or predictions

full rationale

The paper is a fabrication and experimental demonstration report on monolithic BEOL integration of POMPICs with CMOS electronics. It contains no mathematical derivations, fitted parameters, predictions, or self-referential models. All claims rest on wafer-scale processing, characterization, and yield data rather than any chain that reduces to its own inputs by construction. Self-citations (if present) are not load-bearing for any central result. This matches the default expectation of no significant circularity for non-theoretical papers.

Axiom & Free-Parameter Ledger

0 free parameters · 0 axioms · 0 invented entities

Experimental fabrication and integration paper with no mathematical derivations, fitted parameters, or new physical models.

pith-pipeline@v0.9.1-grok · 5858 in / 1040 out tokens · 19922 ms · 2026-07-03T18:17:32.798769+00:00 · methodology

discussion (0)

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Reference graph

Works this paper leans on

81 extracted references · 81 canonical work pages

  1. [1]

    Bogaerts, W. et al. Programmable photonic circuits. Nature 586 , 207–216 (2020)

    work page 2020

  2. [2]

    Dong, M. et al. High-speed programmable photonic circuits in a cryogenically compatible, visible–near-infrared 200 mm CMOS architecture. Nat. Photonics 16 , 59–65 (2022)

    work page 2022

  3. [3]

    Freedman, J. M. et al. Gigahertz-frequency acousto-optic phase modulation of visible light in a CMOS-fabricated photonic circuit. Nat. Commun. 16 , 10959 (2025)

    work page 2025

  4. [4]

    Zhong, H.-S. et al. Quantum computational advantage using photons. Science 370 , 1460–1463 (2020)

    work page 2020

  5. [5]

    Why I am optimistic about the silicon-photonic route to quantum computing

    Rudolph, T. Why I am optimistic about the silicon-photonic route to quantum computing. APL Photonics 2 , 030901 (2017)

    work page 2017

  6. [6]

    Manetsch, H. J. et al. A tweezer array with 6,100 highly coherent atomic qubits. Nature 647 , 60–67 (2025)

    work page 2025

  7. [7]

    Shastri, B. J. et al. Photonics for artificial intelligence and neuromorphic computing. Nat. Photonics 15 , 102–114 (2021)

    work page 2021

  8. [8]

    A., Pernice, W

    Youngblood, N., Rios Ocampo, C. A., Pernice, W. H. P. & Bhaskaran, H. Integrated optical memristors. Nat. Photonics 17 , 561–572 (2023)

    work page 2023

  9. [9]

    Poulton, C. V. et al. Coherent LiDAR with an 8,192-element optical phased array and driving laser. Approved for Public Release; Distribution Unlimited. Public Release Case Number 26-0502 17 IEEE J. Sel. Top. Quantum Electron. 28 , 1–8 (2022)

    work page 2022

  10. [10]

    Kim, T. et al. A single-chip optical phased array in a wafer-scale silicon photonics/CMOS 3D-integration platform. IEEE J. Solid-State Circuits 54 , 3061–3074 (2019)

    work page 2019

  11. [11]

    Sun, C. et al. Single-chip microprocessor that communicates directly using light. Nature 528 , 534–538 (2015)

    work page 2015

  12. [12]

    Daudlin, S. et al. Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links. Nat. Photonics 19 , 502–509 (2025)

    work page 2025

  13. [13]

    E., Baker, M

    Wojciechowski, K. E., Baker, M. S., Clews, P. J. & Olsson, R. H. A fully integrated oven controlled microelectromechanical oscillator—part I: Design and fabrication. J. Microelectromech. Syst. 24 , 1782–1794 (2015)

    work page 2015

  14. [14]

    Crespin, E. R. et al. Fully integrated switchable filter banks. in 2012 IEEE/MTT-S International Microwave Symposium Digest 1–3 (IEEE, 2012)

    work page 2012

  15. [15]

    F., Hornbeck, L

    Van Kessel, P. F., Hornbeck, L. J., Meier, R. E. & Douglass, M. R. A MEMS-based projection display. Proc. IEEE Inst. Electr. Electron. Eng. 86 , 1687–1704 (1998)

    work page 1998

  16. [16]

    & Erdmann, C

    Farley, B., McGrath, J. & Erdmann, C. An All-Programmable 16-nm RFSoC for Digital-RF Communications. IEEE Micro 38 , 61–71 (2018)

    work page 2018

  17. [17]

    Hua, S. et al. An integrated large-scale photonic accelerator with ultralow latency. Nature 640 , 361–367 (2025)

    work page 2025

  18. [18]

    Electronic photonic integrated circuits (EPICs): Fundamentals and applications

    Saxena, V. Electronic photonic integrated circuits (EPICs): Fundamentals and applications. in 2025 IEEE International Symposium on Circuits and Systems (ISCAS) 1–6 (IEEE, 2025)

    work page 2025

  19. [19]

    Giewont, K. et al. 300-mm monolithic silicon photonics foundry technology. IEEE J. Sel. Top. Quantum Electron. 25 , 1–11 (2019)

    work page 2019

  20. [20]

    & Letavic, T

    Kocon, W., Bian, Y., Giewont, K. & Letavic, T. Key technologies and performance aspects for electrical and optical interconnects. in 2025 Symposium on VLSI Technology and Circuits (VLSI Approved for Public Release; Distribution Unlimited. Public Release Case Number 26-0502 18 Technology and Circuits) 1–3 (IEEE, 2025)

    work page 2025

  21. [21]

    McDonough, C. et al. AIM Photonics Demonstration of a 300 mm Si Photonics Interposer. in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 233–238 (IEEE, 2023)

    work page 2023

  22. [22]

    & Englund, D

    Choi, H., Pant, M., Guha, S. & Englund, D. Percolation-based architecture for cluster state creation using photon-mediated entanglement between atomic memories. NPJ Quantum Inf. 5 , 104 (2019)

    work page 2019

  23. [23]

    Patra, B. et al. Cryo-CMOS Circuits and Systems for Quantum Computing Applications. IEEE J. Solid-State Circuits 53 , 309–321 (2018)

    work page 2018

  24. [24]

    C., Renema, J

    Wang, H., Ralph, T. C., Renema, J. J., Lu, C.-Y. & Pan, J.-W. Scalable photonic quantum technologies. Nat. Mater. 24 , 1883–1897 (2025)

    work page 2025

  25. [25]

    Moody, G. et al. 2022 Roadmap on integrated quantum photonics. JPhys Photonics 4 , 012501 (2022)

    work page 2022

  26. [26]

    J., Heideman, R., Geuzebroek, D., Leinse, A

    Blumenthal, D. J., Heideman, R., Geuzebroek, D., Leinse, A. & Roeloffzen, C. Silicon Nitride in Silicon Photonics. Proc. IEEE Inst. Electr. Electron. Eng. 106 , 2209–2231 (2018)

    work page 2018

  27. [27]

    Tran, M. A. et al. Extending the spectrum of fully integrated photonics to submicrometre wavelengths. Nature 610 , 54–60 (2022)

    work page 2022

  28. [28]

    Tian, H. et al. Piezoelectric actuation for integrated photonics. Adv. Opt. Photonics 16 , 749–867 (2024)

    work page 2024

  29. [29]

    Bernson, R. et al. Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips. Opt. Quantum 3 , 569 (2025)

    work page 2025

  30. [30]

    R., Leenheer, A

    Stanfield, P. R., Leenheer, A. J., Michael, C. P., Sims, R. & Eichenfield, M. CMOS-compatible, piezo-optomechanically tunable photonics for visible wavelengths and cryogenic temperatures. Opt. Express 27 , 28588–28605 (2019)

    work page 2019

  31. [31]

    Menssen, A. J. et al. Scalable photonic integrated circuits for high-fidelity light control. Optica 10 , 1366–1372 (2023). Approved for Public Release; Distribution Unlimited. Public Release Case Number 26-0502 19

    work page 2023

  32. [32]

    Castillo, Z. A. et al. CMOS-fabricated ultraviolet light modulator using low-loss alumina piezo-optomechanical photonics. Opt. Quantum 4 , 114 (2026)

    work page 2026

  33. [33]

    Golter, D. A. et al. Selective and Scalable Control of Spin Quantum Memories in a Photonic Circuit. Nano Lett. 23 , 7852–7858 (2023)

    work page 2023

  34. [34]

    Clark, G. et al. Nanoelectromechanical control of spin-photon interfaces in a hybrid quantum system on chip. Nano Lett. 24 , 1316–1323 (2024)

    work page 2024

  35. [35]

    A manufacturable platform for photonic quantum computing

    PsiQuantum team. A manufacturable platform for photonic quantum computing. Nature 641 , 876–883 (2025)

    work page 2025

  36. [36]

    Arrazola, J. M. et al. Quantum circuits with many photons on a programmable nanophotonic chip. Nature 591 , 54–60 (2021)

    work page 2021

  37. [37]

    Wan, N. H. et al. Large-scale integration of artificial atoms in hybrid photonic circuits. Nature 583 , 226–231 (2020)

    work page 2020

  38. [38]

    Tsai, C.-W., Shieh, C.-Y., Lin, T. I. & Tai, K. 5.1: invited paper: digital optics education, research & development, technology infrastructure. Dig. Tech. Pap. 52 , 27–28 (2021)

    work page 2021

  39. [39]

    J., Panuski, C

    Trajtenberg-Mills, S., Elkabbash, M., Brabec, C. J., Panuski, C. L. & Englund, D. R. LNoS: lithium niobate-on-silicon spatial light modulator. Optica 13 , 707 (2026)

    work page 2026

  40. [40]

    Panuski, C. L. et al. A full degree-of-freedom spatiotemporal light modulator. Nat. Photonics 16 , 834–842 (2022)

    work page 2022

  41. [41]

    & Wu, M.-C

    Chen, C.-J., Chen, H.-C., Liao, J.-H., Yu, C.-J. & Wu, M.-C. Fabrication and characterization of active-matrix 960×540 blue GaN-based micro-LED display. IEEE J. Quantum Electron. 55 , 1–6 (2019)

    work page 2019

  42. [42]

    Song, Y. et al. Integrated electro-optic digital-to-analog link for efficient computing and arbitrary waveform generation. Nat. Photonics 19 , 1107–1115 (2025)

    work page 2025

  43. [43]

    Wen, Y. H. et al. Strain-concentration for fast, compact photonic modulation and non-volatile Approved for Public Release; Distribution Unlimited. Public Release Case Number 26-0502 20 memory. Optica 11 , 1511 (2024)

    work page 2024

  44. [44]

    Miller, D. A. B. Perfect optics with imperfect components. Optica 2 , 747 (2015)

    work page 2015

  45. [45]

    Mishra, M. et al. Ultra-low loss piezo-optomechanical low-confinement silicon nitride platform for visible wavelength quantum photonic circuits. arXiv [physics.optics] (2026) doi:10.48550/arXiv.2603.02584

    work page doi:10.48550/arxiv.2603.02584 2026

  46. [46]

    Dong, M. et al. Piezo-optomechanical cantilever modulators for VLSI visible photonics. APL Photonics 7 , 051304 (2022)

    work page 2022

  47. [47]

    Dalmara, R., Utomo, D. R. & Wibowo, S. B. Design of high-speed visible light communication (VLC) transmitter circuit based on discrete components for VLC-based internet of things (IoT) data communication. in 2024 IEEE 10th Information Technology International Seminar (ITIS) 338–343 (IEEE, 2024)

    work page 2024

  48. [48]

    Dai, S., Knepper, R. W. & Horenstein, M. N. A 300-V LDMOS analog-multiplexed driver for MEMS devices. IEEE Trans. Circuits Syst. I Regul. Pap. 62 , 2806–2816 (2015)

    work page 2015

  49. [49]

    & Bogaerts, W

    Ribeiro, A. & Bogaerts, W. Digitally controlled multiplexed silicon photonics phase shifter using heaters with integrated diodes. Opt. Express 25 , 29778–29787 (2017)

    work page 2017

  50. [50]

    & Capmany, J

    Macho-Ortiz, A., Pérez-López, D., Azaña, J. & Capmany, J. Analog Programmable ‐ Photonic Computation. Laser Photon. Rev. 17 , (2023)

    work page 2023

  51. [51]

    & Lipson, M

    Stern, B., Ji, X., Dutt, A. & Lipson, M. Compact narrow-linewidth integrated laser based on a low-loss silicon nitride ring resonator. Opt. Lett. 42 , 4541–4544 (2017)

    work page 2017

  52. [52]

    M., Choi, C

    Park, N. M., Choi, C. J., Seong, T. Y. & Park, S. J. Quantum confinement in amorphous silicon quantum dots embedded in silicon nitride. Phys. Rev. Lett. 86 , 1355–1357 (2001)

    work page 2001

  53. [53]

    C., Englund, D

    Duan, Y., Chen, K. C., Englund, D. R. & Trusheim, M. E. A vertically-loaded diamond microdisk resonator spin-photon interface. Opt. Express 29 , 43082 (2021)

    work page 2021

  54. [54]

    Najafi, F. et al. On-chip detection of non-classical light by scalable integration of single-photon Approved for Public Release; Distribution Unlimited. Public Release Case Number 26-0502 21 detectors. Nat. Commun. 6 , 5873 (2015)

    work page 2015

  55. [55]

    & Mookherjea, S

    Valdez, F., Mere, V. & Mookherjea, S. 100 GHz bandwidth, 1 volt integrated electro-optic Mach–Zehnder modulator at near-IR wavelengths. Optica 10 , 578 (2023)

    work page 2023

  56. [56]

    Dong, M. et al. Synchronous micromechanically resonant programmable photonic circuits. Nat. Commun. 14 , 7716 (2023)

    work page 2023

  57. [57]

    Liu, J. et al. Hybrid scandium aluminum nitride/silicon nitride photonic integrated circuits. ACS Photonics (2026) doi:10.1021/acsphotonics.5c01804

    work page doi:10.1021/acsphotonics.5c01804 2026

  58. [58]

    Liu, J. et al. High-yield, wafer-scale fabrication of ultralow-loss, dispersion-engineered silicon nitride photonic circuits. Nat. Commun. 12 , 2236 (2021)

    work page 2021

  59. [59]

    Le, T.-L. et al. Hybrid electrostatic–piezo MEMS photonic integrated modulators. APL Photonics 11 , 031301 (2026)

    work page 2026

  60. [60]

    Zhang, B. et al. Review of technologies for high-voltage integrated circuits. Tsinghua Sci. Technol. 27 , 495–511 (2022)

    work page 2022

  61. [61]

    Pellerano, S. et al. Cryogenic CMOS for qubit control and readout. in 2022 IEEE Custom Integrated Circuits Conference (CICC) 01–08 (IEEE, 2022)

    work page 2022

  62. [62]

    Malinowski, M., Allcock, D. T. C. & Ballance, C. J. How to wire a 1000 -qubit trapped-ion quantum computer. PRX quantum 4 , (2023)

    work page 2023

  63. [63]

    Cryo-CMOS electronics for quantum computing: Bringing classical electronics closer to qubits in space and temperature

    Charbon, E. Cryo-CMOS electronics for quantum computing: Bringing classical electronics closer to qubits in space and temperature. IEEE Solid-state Circuits Mag. 13 , 54–68 (2021)

    work page 2021

  64. [64]

    Wang, J. et al. 22.1 A cryo-CMOS color-center quantum controller with Diamond waveguide micro-chiplet integration. in 2026 IEEE International Solid-State Circuits Conference (ISSCC) vol. 69 1–3 (IEEE, 2026)

    work page 2026

  65. [65]

    Bartee, S. K. et al. Spin-qubit control with a milli-kelvin CMOS chip. Nature 643 , 382–387 (2025)

    work page 2025

  66. [66]

    Li, L. et al. Heterogeneous integration of spin-photon interfaces with a CMOS platform. Nature 630 , Approved for Public Release; Distribution Unlimited. Public Release Case Number 26-0502 22 70–76 (2024)

    work page 2024

  67. [67]

    Saha, M. et al. Nanophotonic waveguide chip-to-world beam scanning. Nature 651 , 356–363 (2026)

    work page 2026

  68. [68]

    Poulton, C. V. et al. Large-scale silicon nitride nanophotonic phased arrays at infrared and visible wavelengths. Opt. Lett. 42 , 21–24 (2017)

    work page 2017

  69. [69]

    Isichenko, A. et al. Photonic integrated beam delivery for a rubidium 3D magneto-optical trap. Nat. Commun. 14 , 3080 (2023)

    work page 2023

  70. [70]

    & Watts, M

    Raval, M., Yaacobi, A. & Watts, M. R. Integrated visible light phased array system for autostereoscopic image projection. Opt. Lett. 43 , 3678–3681 (2018)

    work page 2018

  71. [71]

    Xu, W. et al. Progress and prospects for LiDAR-oriented optical phased arrays based on photonic integrated circuits. Npj Nanophoton. 2 , 14 (2025)

    work page 2025

  72. [72]

    Platisa, J. et al. High-speed low-light in vivo two-photon voltage imaging of large neuronal populations. Nat. Methods 20 , 1095–1103 (2023)

    work page 2023

  73. [73]

    Walther, J. et al. Optical coherence tomography in biomedical research. Anal. Bioanal. Chem. 400 , 2721–2743 (2011)

    work page 2011

  74. [74]

    Wang, H. et al. Two ‐ photon polymerization lithography for optics and photonics: Fundamentals, materials, technologies, and applications. Adv. Funct. Mater. 33 , 2214211 (2023)

    work page 2023

  75. [75]

    Algaba-Brazález, A., Castillo-Tapia, P., Viganó, M. C. & Quevedo-Teruel, O. Lenses combined with array antennas for the next generation of terrestrial and satellite communication systems. IEEE Commun. Mag. 62 , 176–182 (2024)

    work page 2024

  76. [76]

    Barwicz, T. et al. Integrated optical phase arrays for terrestrial free-space optical communication. in Optical Fiber Communication Conference (OFC) 2026 1–3 (Optica Publishing Group, 2026)

    work page 2026

  77. [77]

    & Wong, Z

    Lin, S., Chen, Y. & Wong, Z. J. High-performance optical beam steering with nanophotonics. Nanophotonics 11 , 2617–2638 (2022)

    work page 2022

  78. [78]

    Lin, Q. et al. Optical multi-beam steering and communication using integrated acousto-optics arrays. Approved for Public Release; Distribution Unlimited. Public Release Case Number 26-0502 23 Nat. Commun. 16 , 4501 (2025)

    work page 2025

  79. [79]

    Golter, D. A. et al. Coherent acoustic control of tin-vacancy spins in a nanophotonic quantum node. in Optica Quantum 2.0 Conference and Exhibition QTu4B.3 (Optica Publishing Group, Washington, D.C., 2025)

    work page 2025

  80. [80]

    Poutievski, L. et al. Jupiter evolving: transforming google’s datacenter network via optical circuit switches and software-defined networking. in Proceedings of the ACM SIGCOMM 2022 Conference (ACM, New York, NY, USA, 2022). doi:10.1145/3544216.3544265

    work page doi:10.1145/3544216.3544265 2022

Showing first 80 references.