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Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

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arxiv 1101.4203 v1 pith:6UXQ6AZF submitted 2011-01-21 physics.ins-det

Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

classification physics.ins-det
keywords sensorsatlaspixelwerebeamchargedetectorelectrodes
verification ladder T0 review T1 audit T2 compute T3 formal T4 reserved
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Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

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